Корпусирование интегральных схем

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Корпусирование интегральных схем

Quality:

Integrated circuit packaging - final stage of semiconductor device fabrication. Article "Корпусирование интегральных схем" in Russian Wikipedia has 16.5 points for quality (as of November 1, 2023). The article contains 2 references and 6 sections.

This article has the best quality in Japanese Wikipedia. However, the most popular language version of this article is English.

Since the creation of article "Корпусирование интегральных схем", its content was written by 18 registered users of Russian Wikipedia and edited by 220 registered Wikipedia users in all languages.

The article is cited 38 times in Russian Wikipedia and cited 500 times in all languages.

The highest Authors Interest rank from 2001:

  • Local (Russian): #22874 in December 2011
  • Global: #76930 in September 2021

The highest popularity rank from 2008:

  • Local (Russian): #186350 in February 2012
  • Global: #78794 in June 2010

There are 9 language versions for this article in the WikiRank database (of the considered 55 Wikipedia language editions).

The quality and popularity assessment was based on Wikipédia dumps from November 1, 2023 (including revision history and pageviews for previous years).

下表顯示了最高品質的文章的語言版本。

Languages with the highest quality

#LanguageQuality gradeQuality score
1Japanese (ja)
パッケージ (電子部品)
60.7184
2English (en)
Integrated circuit packaging
47.5611
3Chinese (zh)
集成电路封装
24.6433
4Catalan (ca)
Encapsulat dels circuits integrats
24.6378
5Russian (ru)
Корпусирование интегральных схем
16.5229
6Persian (fa)
بسته‌بندی مدار مجتمع
14.7644
7German (de)
Aufbau- und Verbindungstechnik
2.9532
8Ukrainian (uk)
Корпусування мікросхем
1.8052
9French (fr)
Encapsulation (électronique)
1.7104
More...

The following table shows the most popular language versions of the article.

Most popular in all the time

The most popular language versions of the article "Корпусирование интегральных схем" in all the time
#LanguagePopularity awardRelative popularity
1Japanese (ja)
パッケージ (電子部品)
1 521 587
2English (en)
Integrated circuit packaging
844 162
3German (de)
Aufbau- und Verbindungstechnik
94 000
4Chinese (zh)
集成电路封装
76 134
5Russian (ru)
Корпусирование интегральных схем
38 814
6French (fr)
Encapsulation (électronique)
11 168
7Ukrainian (uk)
Корпусування мікросхем
4 881
8Catalan (ca)
Encapsulat dels circuits integrats
1 668
9Persian (fa)
بسته‌بندی مدار مجتمع
506
More...

The following table shows the language versions of the article with the highest popularity in the last month.

Most popular in October 2023

The most popular language versions of the article "Корпусирование интегральных схем" in October 2023
#LanguagePopularity awardRelative popularity
1English (en)
Integrated circuit packaging
3 087
2Japanese (ja)
パッケージ (電子部品)
1 296
3Chinese (zh)
集成电路封装
804
4Russian (ru)
Корпусирование интегральных схем
197
5German (de)
Aufbau- und Verbindungstechnik
189
6French (fr)
Encapsulation (électronique)
32
7Catalan (ca)
Encapsulat dels circuits integrats
24
8Ukrainian (uk)
Корпусування мікросхем
22
9Persian (fa)
بسته‌بندی مدار مجتمع
16
More...

The following table shows the language versions of the article with the highest Authors’ Interest.

The highest AI

Language versions of the article "Корпусирование интегральных схем" with the highest Authors Interest (number of authors). Only registered Wikipedia users were taken into account.
#LanguageAI awardRelative AI
1English (en)
Integrated circuit packaging
93
2Japanese (ja)
パッケージ (電子部品)
56
3German (de)
Aufbau- und Verbindungstechnik
20
4Russian (ru)
Корпусирование интегральных схем
18
5French (fr)
Encapsulation (électronique)
13
6Chinese (zh)
集成电路封装
8
7Ukrainian (uk)
Корпусування мікросхем
6
8Catalan (ca)
Encapsulat dels circuits integrats
4
9Persian (fa)
بسته‌بندی مدار مجتمع
2
More...

The following table shows the language versions of the article with the highest Authors’ Interest in the last month.

The highest AI in October 2023

Language versions of the article "Корпусирование интегральных схем" with the highest AI in October 2023
#LanguageAI awardRelative AI
1Chinese (zh)
集成电路封装
2
2Catalan (ca)
Encapsulat dels circuits integrats
0
3German (de)
Aufbau- und Verbindungstechnik
0
4English (en)
Integrated circuit packaging
0
5Persian (fa)
بسته‌بندی مدار مجتمع
0
6French (fr)
Encapsulation (électronique)
0
7Japanese (ja)
パッケージ (電子部品)
0
8Russian (ru)
Корпусирование интегральных схем
0
9Ukrainian (uk)
Корпусування мікросхем
0
More...

The following table shows the language versions of the article with the highest number of citations.

The highest CI

Language versions of the article "Корпусирование интегральных схем" with the highest Citation Index (CI)
#LanguageCI awardRelative CI
1Japanese (ja)
パッケージ (電子部品)
196
2English (en)
Integrated circuit packaging
111
3Catalan (ca)
Encapsulat dels circuits integrats
46
4Russian (ru)
Корпусирование интегральных схем
38
5Chinese (zh)
集成电路封装
32
6Ukrainian (uk)
Корпусування мікросхем
31
7German (de)
Aufbau- und Verbindungstechnik
25
8Persian (fa)
بسته‌بندی مدار مجتمع
12
9French (fr)
Encapsulation (électronique)
9
More...

Scores

Estimated value for Wikipedia:
Russian:
Global:
Popularity in October 2023:
Russian:
Global:
Popularity in all years:
Russian:
Global:
Authors in October 2023:
Russian:
Global:
Registered authors in all years:
Russian:
Global:
Citations:
Russian:
Global:

Quality measures

Interwikis

#LanguageValue
caCatalan
Encapsulat dels circuits integrats
deGerman
Aufbau- und Verbindungstechnik
enEnglish
Integrated circuit packaging
faPersian
بسته‌بندی مدار مجتمع
frFrench
Encapsulation (électronique)
jaJapanese
パッケージ (電子部品)
ruRussian
Корпусирование интегральных схем
ukUkrainian
Корпусування мікросхем
zhChinese
集成电路封装

Popularity rank trends

Best Rank Russian:
#186350
02.2012
Global:
#78794
06.2010

AI rank trends

Best Rank Russian:
#22874
12.2011
Global:
#76930
09.2021

Languages comparison

Important global interconnections

Wikipedia readers most often find their way to information on Integrated circuit packaging from Wikipedia articles about BGA, Semiconductor device fabrication, Integrated circuit, Semiconductor package and LGA. Whereas reading the article about Integrated circuit packaging people most often go to Wikipedia articles on Integrated circuit packaging type, Quad Flat Package, Ball grid array, Pin grid array and Chip carrier.

Cumulative results of quality and popularity of the Wikipedia article

List of Wikipedia articles in different languages (starting with the most popular):

News from 22 May 2024

On 22 May 2024 in multilingual Wikipedia, Internet users most often read articles on the following topics: Ademola Lookman, Atalanta BC, Toni Kroos, Gian Piero Gasperini, Bayer 04 Leverkusen, international recognition of the State of Palestine, UEFA Europa League, Ebrahim Raisi, State of Palestine, YouTube.

In Russian Wikipedia the most popular articles on that day were: Яндекс, YouTube, Годовщины свадьбы, Новая Каледония, Раиси, Ибрахим, Государство Палестина, Международно-правовой статус Государства Палестина, Ходорковский, Михаил Борисович, Усик, Александр Александрович, Аталанта (футбольный клуб).

About WikiRank

The WikiRank project is intended for automatic relative evaluation of the articles in the various language versions of Wikipedia. At the moment the service allows to compare over 44 million Wikipedia articles in 55 languages. Quality scores of articles are based on Wikipedia dumps from November, 2023. When calculating current popularity and AI of articles data from October 2023 was taken into account. For historical values of popularity and AI WikiRank used data from 2001 to 2023... More information