Корпусирование интегральных схем

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Корпусирование интегральных схем

Quality:

Integrated circuit packaging - final stage of semiconductor device fabrication. Article "Корпусирование интегральных схем" in Russian Wikipedia has 16.5 points for quality (as of July 1, 2025). The article contains 2 references and 6 sections.

This article has the best quality in Japanese Wikipedia. However, the most popular language version of this article is English.

Since the creation of article "Корпусирование интегральных схем", its content was written by 21 registered users of Russian Wikipedia and edited by 236 registered Wikipedia users in all languages.

The article is cited 52 times in Russian Wikipedia and cited 595 times in all languages.

The highest Authors Interest rank from 2001:

  • Local (Russian): #22522 in April 2025
  • Global: #76984 in September 2021

The highest popularity rank from 2008:

  • Local (Russian): #185984 in February 2012
  • Global: #78657 in June 2010

There are 11 language versions for this article in the WikiRank database (of the considered 55 Wikipedia language editions).

The quality and popularity assessment was based on Wikipédia dumps from July 1, 2025 (including revision history and pageviews for previous years).

The table below shows the language versions of the article with the highest quality.

Languages with the highest quality

#LanguageQuality gradeQuality score
1Japanese (ja)
パッケージ (電子部品)
60.4542
2English (en)
Integrated circuit packaging
57.6928
3Arabic (ar)
حفظ الدارات المتكاملة
33.7081
4Chinese (zh)
集成电路封装
26.0703
5Catalan (ca)
Encapsulat dels circuits integrats
24.4726
6Russian (ru)
Корпусирование интегральных схем
16.4773
7Persian (fa)
بسته‌بندی مدار مجتمع
14.6613
8Indonesian (id)
Pengemasan sirkuit terpadu
13.8715
9French (fr)
Encapsulation (électronique)
3.6217
10German (de)
Aufbau- und Verbindungstechnik
2.9366
More...

The following table shows the most popular language versions of the article.

Most popular in all the time

The most popular language versions of the article "Корпусирование интегральных схем" in all the time
#LanguagePopularity awardRelative popularity
1Japanese (ja)
パッケージ (電子部品)
1 541 215
2English (en)
Integrated circuit packaging
897 540
3German (de)
Aufbau- und Verbindungstechnik
97 835
4Chinese (zh)
集成电路封装
91 471
5Russian (ru)
Корпусирование интегральных схем
43 970
6French (fr)
Encapsulation (électronique)
11 914
7Ukrainian (uk)
Корпусування мікросхем
5 377
8Catalan (ca)
Encapsulat dels circuits integrats
1 887
9Persian (fa)
بسته‌بندی مدار مجتمع
842
10Indonesian (id)
Pengemasan sirkuit terpadu
149
More...

The following table shows the language versions of the article with the highest popularity in the last month.

Most popular in June 2025

The most popular language versions of the article "Корпусирование интегральных схем" in June 2025
#LanguagePopularity awardRelative popularity
1English (en)
Integrated circuit packaging
2 212
2Japanese (ja)
パッケージ (電子部品)
647
3Chinese (zh)
集成电路封装
455
4German (de)
Aufbau- und Verbindungstechnik
139
5Russian (ru)
Корпусирование интегральных схем
126
6French (fr)
Encapsulation (électronique)
35
7Ukrainian (uk)
Корпусування мікросхем
25
8Persian (fa)
بسته‌بندی مدار مجتمع
9
9Arabic (ar)
حفظ الدارات المتكاملة
8
10Catalan (ca)
Encapsulat dels circuits integrats
6
More...

The following table shows the language versions of the article with the highest Authors’ Interest.

The highest AI

Language versions of the article "Корпусирование интегральных схем" with the highest Authors Interest (number of authors). Only registered Wikipedia users were taken into account.
#LanguageAI awardRelative AI
1English (en)
Integrated circuit packaging
97
2Japanese (ja)
パッケージ (電子部品)
59
3Russian (ru)
Корпусирование интегральных схем
21
4German (de)
Aufbau- und Verbindungstechnik
20
5French (fr)
Encapsulation (électronique)
15
6Chinese (zh)
集成电路封装
9
7Ukrainian (uk)
Корпусування мікросхем
6
8Catalan (ca)
Encapsulat dels circuits integrats
4
9Persian (fa)
بسته‌بندی مدار مجتمع
2
10Indonesian (id)
Pengemasan sirkuit terpadu
2
More...

The following table shows the language versions of the article with the highest Authors’ Interest in the last month.

The highest AI in June 2025

Language versions of the article "Корпусирование интегральных схем" with the highest AI in June 2025
#LanguageAI awardRelative AI
1Arabic (ar)
حفظ الدارات المتكاملة
0
2Catalan (ca)
Encapsulat dels circuits integrats
0
3German (de)
Aufbau- und Verbindungstechnik
0
4English (en)
Integrated circuit packaging
0
5Persian (fa)
بسته‌بندی مدار مجتمع
0
6French (fr)
Encapsulation (électronique)
0
7Indonesian (id)
Pengemasan sirkuit terpadu
0
8Japanese (ja)
パッケージ (電子部品)
0
9Russian (ru)
Корпусирование интегральных схем
0
10Ukrainian (uk)
Корпусування мікросхем
0
More...

The following table shows the language versions of the article with the highest number of citations.

The highest CI

Language versions of the article "Корпусирование интегральных схем" with the highest Citation Index (CI)
#LanguageCI awardRelative CI
1Japanese (ja)
パッケージ (電子部品)
218
2English (en)
Integrated circuit packaging
121
3Chinese (zh)
集成电路封装
55
4Russian (ru)
Корпусирование интегральных схем
52
5Catalan (ca)
Encapsulat dels circuits integrats
47
6Ukrainian (uk)
Корпусування мікросхем
33
7German (de)
Aufbau- und Verbindungstechnik
24
8Indonesian (id)
Pengemasan sirkuit terpadu
18
9Persian (fa)
بسته‌بندی مدار مجتمع
16
10French (fr)
Encapsulation (électronique)
10
More...

Scores

Estimated value for Wikipedia:
Russian:
Global:
Popularity in June 2025:
Russian:
Global:
Popularity in all years:
Russian:
Global:
Authors in June 2025:
Russian:
Global:
Registered authors in all years:
Russian:
Global:
Citations:
Russian:
Global:

Quality measures

Interwikis

#LanguageValue
arArabic
حفظ الدارات المتكاملة
caCatalan
Encapsulat dels circuits integrats
deGerman
Aufbau- und Verbindungstechnik
enEnglish
Integrated circuit packaging
faPersian
بسته‌بندی مدار مجتمع
frFrench
Encapsulation (électronique)
idIndonesian
Pengemasan sirkuit terpadu
jaJapanese
パッケージ (電子部品)
ruRussian
Корпусирование интегральных схем
ukUkrainian
Корпусування мікросхем
zhChinese
集成电路封装

Popularity rank trends

Best Rank Russian:
#185984
02.2012
Global:
#78657
06.2010

AI rank trends

Best Rank Russian:
#22522
04.2025
Global:
#76984
09.2021

Languages comparison

Important global interconnections (July 2024 – June 2025)

Wikipedia readers most often find their way to information on Integrated circuit packaging from Wikipedia articles about Socket AM5, Besi, Integrated circuit, Semiconductor device fabrication and Die. Whereas reading the article about Integrated circuit packaging people most often go to Wikipedia articles on Integrated circuit packaging type, Semiconductor package, Ball grid array, Pin grid array and Semiconductor device fabrication.

Cumulative results of quality and popularity of the Wikipedia article

List of Wikipedia articles in different languages (starting with the most popular):

News from 12 August 2025

On 12 August 2025 in multilingual Wikipedia, Internet users most often read articles on the following topics: Cristiano Ronaldo, Wednesday, Georgina Rodríguez, ChatGPT, Weapons, Jenna Ortega, deaths in 2025, Taylor Swift, Miguel Uribe Turbay, 2025–26 UEFA Champions League.

In Russian Wikipedia the most popular articles on that day were: Яндекс, Главы Курска, Анкоридж, Аляска, Уэнздей (2-й сезон), Катастрофа АПЛ «Курск», Бутусов, Юрий Николаевич, Продажа Аляски, К-141 «Курск», Корж, Макс.

About WikiRank

The WikiRank project is intended for automatic relative evaluation of the articles in the various language versions of Wikipedia. At the moment the service allows to compare over 44 million Wikipedia articles in 55 languages. Quality scores of articles are based on Wikipedia dumps from July, 2025. When calculating current popularity and AI of articles data from June 2025 was taken into account. For historical values of popularity and AI WikiRank used data from 2001 to 2025... More information